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Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
- TEAM SOLUTIONS, INC.
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IEEE-488 GPIB Device Interface IC (Chip) for the PCI-Bus
GPIB-72120
The i72120 GPIB-Chip is the ideal solution to implement a IEEE488.2 GPIB interface for next generation PCI based instruments. The GPIB-ASIC is designed to meet all of the functional requirements for talker and listener (TL) devices as specified by the IEEE Standards 488.1-1987 and 488.2-1987. Connected between the PCI bus and the GPIB, this GPIB-IC provides high-level management of the GPIB to unburden the processor and to simplify both hardware and software design. The i72120 is fully compatible with the PCI specification and requires only the addition of bus driver/receiver components to implement a talker/listener GPIB interface.
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Anti-Surge Chip Resistors (Double-Sided Resistive)
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Thermal Cycling Test Equipment
Wewon Environmental Chambers Co, Ltd.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in timehttps://www.wewontech.com/thermal-cycling-test-equipment/
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Chip Resistor Networks/Arrays
Panasonic Industrial Devices Sales Company of America
Panasonic’s Chip Resistor Arrays are offered in cases from 0201 to 0805. The smaller 0201 case sizes are available with flat terminations and all other case sizes are offered with either convex or concave terminations. The EXB Series Resistor Arrays are available in 2, 4, or 8 Resistors per package. These Resistor Arrays allow for an improvement of the placement efficiency. Compliance Standards include: IEC 60115-9, JIS C 5201-9, EIAJ RC-2129, AEC-Q200 and RoHS.Panasonic’s Resistor Networks are available in 8 or 15 bussed Resistors and are recommended for all pull up/down circuits.
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Inductor Tester
An impulse can be applied to the coil of a chip power inductor to perform insulation tests (surge tests) within the windings.
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Accelerometers
Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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Varactor Tuning Diodes
Macom Technology Solutions Holdings Inc.
MACOM’s GaAs and Silicon varactor tuning diodes provide broadband performance ranging from 10 MHz to 70 GHz. They are ideal for high Q filter and VCO electronic tuning circuits and are available in die form, flip chip, plastic and ceramic packaging. These GaAs diodes boast a constant gamma series for higher frequency and high Q applications and silicon abrupt and hyper abrupt series in plastic packaging are suitable for high volume surface mount applications.
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Tantalum-Polymer
POSCAP™
Panasonic Industrial Devices Sales Company of America
Panasonic POSCAP™ Solid Electrolyte Chip Capacitors offer stable capacitance at high frequency and temperature, with low-ESR/ESL. These Capacitors utilize a sintered tantalum anode with a proprietary high-conductivity polymer cathode. Panasonic's innovative construction and processing yields one of the lowest ESR levels in Tantalum-Polymer Capacitor technology, while exhibiting excellent performance in high frequency applications. POSCAP Capacitors are available in various, compact package sizes for a small PCB footprint while offering high volumetric efficiency for capacitance. In addition, Panasonic’s POSCAP parts demonstrate high reliability and high heat resistance, making them the ideal Chip Capacitor for digital, high-frequency devices and more.
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Memory Interface Chips
Providing memory bandwidth and capacity to unleash the power of multicore processors
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X-Ray Inspection System
MX1
Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
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10-CH General Purpose Timer/Counter & 8-CH DIO Module
cPCI-8554
- PICMG 2.0 Rev 3.0- Four 82C54 programmable timer/counter chips- Up to 12-CH 16-bit timer/counter- 1-CH 32-bit cascaded timer based on 8 MHz clock source- Four programmable clock sources for each timer/counter- Programmable de-bounce filters for external clock & external interrupt inputs- 8-CH TTL digital inputs & 8-CH TTL digital outputs- +12 V and +5 V power available on the connector
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Gaussmeter
DX-102
DX-102 Gaussmeter is a portable gauss meter, based on the latest progress of Hall effect magnetic field measuring instrument, adopted DSP technology. Test probe adopts import GaAs linear Hall chip, the difference between any two probes is small, if damaged, it can be replaced directly. DX-102 Gaussmeter is an ideal DC magnetic field test instrument.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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OEM CCD Camera
Syncerity BI-NIR Camera
The TE-cooled back illuminated 2048 x 70 CCD Camera combines affordability, performance and versatility for OEM applications. With peak QE of 84% @ 700nm and 20% at 1050nm, Syncerity BI-NIR offers a relatively broad response and addresses multiple applications. In the near-NIR, this detector is a much lower cost alternative to a deep depleted CCD, with no etaloning. Syncerity’s flexible design allows our OEM-dedicated team to quickly adapt the camera for industrial requirements, ranging from alternate CCD chips to electronics
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Dummy Test Wafers/Chips
Advanced Dummy Test Wafers/Chips available with over 35 different chip designs and choices of 11 different material configurations as well as kits complete with test vehicles. Custom-make test production of TEG wafer/glass (TEG=Test Element Group). Design and provide custom-make test kit.
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PC/104 Single Board Computer with Vortex86DX3 System-on-Chip
CM1-86DX3
The CoreModule CM1-86DX3 is a PC/104 board with DMP Vortex86-DX3 single chip solution and has a very good performance to power ratio. The board comprises all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CM1-86DX3 integrates a powerful yet efficient DMP Vortex86DX3 with graphic controller and audio controller together with an additional GBit Ethernet controller to form a complete PC, with all the standard peripherals already onboard. Two Ethernet ports (1x GBit and 1x 100MBit), four RS232/RS422/RS485 serial ports, two USB 2.0 host controller to handle the communication with external devices. There are PS/2 connectors for keyboard and mouse. A first generation SATA interface allows the connection of hard disk or CD drive. CFast is also available. System expansion can easily be realized over the PC/104 bus connectors.
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Chip Resistors
Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide range of Chip Resistors including conventional Thick Film Chip Resistors, Specialized Resistors such as Thin Film, Current Sense, Anti-Sulfur, Anti-Surge and Metal Film Chip Resistors.Panasonic’s standard Thick Film Chip Resistors are offered in cases sizes from 01005 to 2512.
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PIN Diodes
The SemiGen SGP7000 series of PIN Diodes are processed with a high-resistivity epi that have intrinsic layers that range in thickness from 4 micron to 200 micron depending on performance specifications. These devices are typically manufactured with either a robust thermal-oxide passivation or ceramic glass for durable high-power applications. These diodes are made with a grown junction P++ layer that yields abrupt junction structures that provide low punch through voltages and minimize autodoping. They are available as chips or in your choice of packages.
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2MP Wide Temperature Range Industrial Grade HDR Camera
e-CAM20_CU0230_MOD
e-CAM20_CU0230_MOD is a 2MP high performance, HDR Camera Module with excellent low light performance. It is based on AR0230AT CMOS Image sensor from ON Semiconductor®. It has an ability to stream seamlessly at wide temperature range (-40 to 105°C) which is suitable for Automotive application. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. e-CAM20_CU0230_MOD has a dedicated, high-performance Image Signal Processor chip (ISP) that performs the entire Auto functions (Auto White Balance, Auto Exposure control).
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AC Quantum Voltmeter
are based on a programmable Josephson voltage standard chip and are used for high-precision voltage measurements in the range from dc and ac to kHz frequencies.
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SparkFun Pulse Oximeter And Heart Rate Sensor
MAX30101 & MAX32664 (Qwiic)
The SparkFun Pulse Oximeter and Heart Rate Sensor is an I2C based biometric sensor, utilizing two chips from Maxim Integrated: the MAX32664 Biometric Sensor Hub and the MAX30101 Pulse Oximetry and Heart Rate Module. While the latter does all the sensing, the former is an incredibly small and fast Cortex M4 processor that handles all of the algorithmic calculations, digital filtering, pressure/position compensation, advanced R-wave detection, and automatic gain control. We've provided a Qwiic connector to easily connect to the I2C data lines but you will also need to connect to two additional lines. This board is very small, measuring at 1in x 0.5in (25.4mm x 12.7mm), which means it will fit nicely on your finger without all the bulk.
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COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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High Soeed CMOS System on Chip (SoC) Line Scan Image Sensor
LS4k
The LS4k is a high speed CMOS System on Chip (SoC) line scan image sensor optimized for applications requiring short exposure times and high accuracy line rates. It incorporates on chip two pixel arrays consisting of 2 rows with 4,096 7µm pitch pixels and 4 rows with 2,048 14µm pitch pixels respectively, a high accuracy (12-bit) high speed (84MHz) analog-to-digital conversion (ADC), and sophisticated on chip optical calibration for PRNU, DSNU, and lens shading correction.
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Thick Film Chip Resistors
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Digital Receiver Exciter (DREX)
CAES provides high performance, compact, rugged, DREX modules utilizing surface mount and hybrid chip and wire technology as required by the end application. End applications span radar, electronic warfare, missile, and space applications.
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10G DFB Laser Diode Chips
Guilin GLsun Science and Tech Group Co., LTD
10G DFB Laser Diode Chips by GLSN
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Software
SSI-TRES
Was developed to read and edit Plug and Play Smart Sensors that are compliant to the IEEE 1451.4 Standard. TEDS, or transducer Electronic Data Sheet, is a set of electronic data in a standardized format defined within the IEEE 1451.4 standard. This data specifies what type of sensor is present, describes its interface, and gives technical information such as sensitivity, bridge type , excitation, etc. This information is stored in an EEPROM chip attached to the sensor. By having this chip, the sensor can identify and describe itself to the network and or Smart Load Cell Meter (DPM-3), thereby easing automatic system configuration.
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10G APD Photodiodes
Macom Technology Solutions Holdings Inc.
MACOM offers the highest sensitivity avalanche photodiodes (APD) on the market to satisfy 10Gtelecom and datacom applications. Both front-illuminated and back-illuminated chips are available and usable from 1250 to 1650 nm for bit rates up to 11.3 Gb/s. Proprietary designs enable superior bandwidth, excellent temperature stability and high reliability to support market needs.
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Peak Track Instrument
90323
The model 90323 Peak Track Instrument is a general-purpose sensor readout device designed to complement our AutoID line of load cells and torque sensors. AutoID is a term that indicates that the calibration information for a sensor is stored on a chip inside the sensor’s connector. AutoID allows true “plug and play” operation without manual calibration procedures of any kind. The unit is also equipped with a 2-line alpha-numeric display and single button operation for simplicity.
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Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Enhance Transactional Universal Verification Methodology (UVM) testbenches
TrekUVM
TrekUVM automatically generates self-verifying test cases that run in existing transactional testbenches, including those compliant with the Universal Verification Methodology (UVM) standard. This verifies your chips more quickly and more thoroughly than using UVM alone to generate transactions. TrekUVM's generated test cases target all aspects of full-chip verification and work in a variety of different environments.
