Filter Results By:
Products
Applications
Manufacturers
- Virginia Panel Corporation
product
Module Accessory Kit, Quantity 26, 4-40 x .625" Captive Socket Head Cap Screws
510109366
Used with modules: 510104135, 510104136, 510150115, 510150116, 510150130, 510150136, 510150137, 510150147, 510151105, 510151106 and 510151124.
-
product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
-
product
BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
-
product
Burn-In Test Sockets
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
-
product
Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
-
product
LGA Sockets
We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
-
product
QFN/QFP35 Sockets
Test sockets are designed for testing today’s high-performance QFN, QFP, DFN and SOIC devices. For development, characterization, at speed burn-in, and low volume production manual testing.
-
product
Semiconductor
With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
-
product
Burn-in and Test Sockets
Loranger International Corporation
Loranger International Corporation designs and manufactures thousands of socket styles for the burn-in and test of semiconductors and electronic components. Some of the socket styles are listed below.
-
product
BIB Loading
FALCON Series
The Falcon Series is an automated BIB loading and unloading machine. It is designed to provide precise high-speed loading of DUTs from Trays/Tube to Burn-in boards and precise high-speed unloading of DUTs from Burn-in boards to Trays/Tube for different device packages. The Falcon Series also has a simple conversion kit which allows end-users to re-configure the equipment for different types of sockets and package combinations.
-
product
Burn-In Board Tester
Focus-275
Focus275 is a tester for burn-in board.It can improve reliability of burn-in board by inspecting boards for burn-in test by Focus275 regularlyBoth short open test and component test can be done by sending electric signals for special socket contactor and edge part.
-
product
Burn-In Test
C.C.P. Contact Probes Co., LTD.
Customized Burn-In Test Sockets for temperatures of up to 180°C.
-
product
Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
-
product
Burn-In Systems
OPTIMUM Series
Advanced Microtechnology, Inc.
The OPTIMUM product line of burn-in systems has a model to meet your individual testing requirements. Please select one of the models below for more specific information
-
product
Burn-in Systems
Incal Offers A Line Of State-Of-The-Art Burn-In Testing Hardware And Software For Retrofit And/Or Total, Customized Burn-In System Configurations.
-
product
Burn-In Boards
Manufacture of burn-in boards since 1976. Established for more than 40 years in the market, Trio-Tech is recognized and is an approved global supplier to all major semiconductor companies. Trio-Tech has the capability to design and manufacture boards for all system types, with solutions available for many test conditions, Including HTOL, PTC, HAST and 85/85.
-
product
Memory Burn-in Tester
B6700 Series
B6700 can test as many as 48 burn-in boards in parallel at speeds up to 10 MHz, which helps memory suppliers get their newest products to market faster while also reducing testing costs. An original high performance chamber improves yield by assuring high temperature accuracy while generating high temperature. It also shortens the temperature rise and fall time which leads to shortening the test time.
-
product
Memory Burn-In Tester
H5620/H5620ES
As Server and Mobile applications have mainly led the Memory and market has also entered a super cycle that has completely withdrawn from the previous silicon cycle.Memory capacitance will continue to rise as the application of data processing and mobile communication occurs—however, revenue will not grow as ASP goes down. Suppliers need to reduce test costs and increase profits.H5620 contributes to reduction of test cost by integrating the test process of DRAM Burn-in and Core Test. This hybrid memory test solution solves the challenge of reducing test costs while increasing test efficiency in the expanding DRAM market.
-
product
Environment And Burn-in Temperature Chambers
9000 Series
Delta 9000 Series Temperature Chambers offer a wide choice of temperature ranges and capacities in addition to smart electronics. Field proven by satisfied customers for over four decades, Delta chambers are quality instruments that provide service longevity and integrity unique in their field. Over the years, Cohu has added advanced features to the proven basic chamber design and has refined system components and programming capability to deliver outstanding quality and value.
-
product
Test Sockets
QFN/QFP
For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
-
product
Burn-In Boards
Meets burn-in requirements, including extreme temperatures or continual handling. 2 or more layers of polyimide. 200 C maximum temperature. Gold-plated connectors.
-
-
product
ATE Socket
Design ATE socket according to customer's requirementsUse on auto-test eqiupments and handler.Pitch range from 0.30 to 1.0mm.Pin amount: 2 and above.Key material: Peek,Torlon.etcContact with top pogo pin
-
product
Test Socket
Our test sockets are made for high performance and are of top quality, to guarantee a smooth, effortless process. We believe in providing our partners and customers with effective and intelligent solutions that they can apply with ease. Choose the solutions of TTS Group cater to the needs of detailed and complex systems.
-
product
Test Sockets
Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
-
product
Test Sockets
Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
-
product
Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
-
product
Test Sockets
socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
-
product
BGA Sockets
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
-
product
Probe “Socket” Clamps
LCP-S12
A simple and cost-effective option for mounting Small-aperture Probes in the probe plate. A Socket Clamp tool is needed for insertion and removal of the clamp in the probe plate
-
product
Advanced Burn-in and Test System for packaged parts
ABTS-Li
High power logic individual temperature control
