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ASIC
Application Specific Integrated Circuits are application specific custom made ICs.
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Digital Solutions
Dexter's Digital Detectors and Temperature Sensor Modules (TSM's) are based on Dexter's superior silicon thermopile technology and incorporate an ASIC that provides a cost effective front end for reading out the detector output. The digital solutions include pre-amplification, A/D, multi-plexing and SMBus communications. Additionaly, the SMBus can accommodate communications with up to 100 digital products. Our digital solutions are housed in industry standard TO-5/TO-39 packages.
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Universal PMICs
PowerArchitect™ design and configuration software speeds development and significantly reduces overall time-to-market compared to legacy analog power solutions. An I²C interface and multiple GPIO pins ensure easy system integration. Configurable warning and fault levels, fault behavior and power up and down sequencing ensure any load can be properly powered and protected. The power system design can be completed with confidence long before the final revision of the SoC or ASIC is available.
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Centralized Motion Controller
ADLINK‘s pulse train controllers provide comprehensive and application-oriented motion functions for servo and stepper motors through digital signal processing (DSP)-based and Application Specific Integrated Circuit (ASIC)-based two pulse train mode controllers to achieve excellent synchronous motion control and precise positioning suitable for laser engraving, marking and cutting applications in semiconductor, AOI, and conventional manufacturing industries.
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3U VPX Flash Storage Module
Curtiss-Wright Defense Solutions
The 3U VPX (VITA 46 and 48.2) Flash Storage Module (FSM) provides high-performance, high-capacity, solid-state SATA storage with AES-256 bit encryption using an Application Specific Integrated Circuit (ASIC) that is FIPS-140-2 validated (Certification #1472). The 1" pitch conduction-cooled solid state storage device utilizes high reliability SLC NAND flash designed for the most demanding application.
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The Intel® RealSense™ Depth Sensing Portfolio
Intel® RealSense™ offers a range of stereo vision cameras and modules, supported by an extensive open-source SDK. The D400 product line helps you ensure that you can add robust three-dimensional vision capability to your products or systems. The cameras feature an integrated ASIC that performs real-time depth calculation directly on the camera, saving you processing resources on the host system. The SDK allows you to further tune the depth data stream to your needs.
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CompuScope GPU CUDA Processing
Performing real-time digital signal processing (DSP) routines such as Fast Fourier Transform (FFT), Signal Averaging, Finite Impulse Response (FIR) Filtering, Digital Down Conversion (DDC) and more have traditionally required the use of dedicated DSP processors, Field Programmable Gate Arrays (FPGAs), or Application Specific Integrated Circuits (ASICs).
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GRIDSCAN 5000
Hydrogen Series
The H2scan GRIDSCAN 5000 Hydrogen Sensor pairs a high performance ASIC to H2scan’s field-proven solid-state hydrogen sensor. This stand-alone sensor system has been designed to provide precision hydrogen measurement, at a lower cost for the high-volume OEM or utilities. No calibrations or maintenance is needed for up to 10 years, and the GRIDSCAN 5000 is the lowest cost by thousands to any other available hydrogen DGA system. H2scan is the only company in the industry that can state retail sales of over 15,000 sensor systems worldwide with no after sale calibrations performed since 2012.
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ASIC
Is an integrated circuit (IC) chip customized for a particular use, rather than intended for general-purpose use, such as a chip designed to run in a digital voice recorder or a high-efficiency video codec.
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SparkFun Qwiic MicroPressure Sensor
The SparkFun Qwiic MicroPressure Sensor is a miniature breakout equipped with Honeywell's 25psi piezoresistive silicon pressure sensor. This MicroPressure Sensor offers a calibrated and compensated pressure sensing range of 60mbar to 2.5bar, easy to read 24 bit digital I2C output, and can be calibrated and compensated over a specific temperature range for sensor offset, sensitivity, temperature effects, and non-linearity using an on-board Application Specific Integrated Circuit (ASIC). With its ultra-low power consumption and Qwiic ports, you've got yourself a power packed little sensor!
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Pressure Sensors
ESCP-MIS1 Sensor
ES Systems has developed a series of medium isolated pressure sensors suitable for applications with harsh environmental conditions where resistance to corrosive fluids or gases is required. Each sensor integrates a MEMS capacitive pressure sensor die, and a CMOS ASIC for the signal conditioning. The MEMS pressure sensor dies are underpinned by ES’s innovative microfabrication process for silicon capacitive sensors.
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Digital Oscilloscope
MSO/DS7000
The MSO/DS7000 series digital oscilloscope is a mid-end mixed-signal digital oscilloscope based on RIGOL's proprietary intellectual property ASIC chip and UltraVision II technology platform.
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Clock Domain Crossing Sign-off Solution
Meridian CDC
Meridian CDC is the fastest, highest capacity and most precise CDC solution in the market. It performs comprehensive structural and functional analysis to ensure that signals crossing asynchronous clock domains on ASIC, or FPGA devices are received reliably. Meridian CDC is the only solution that enables all aspects of CDC sign-off for giga-gate SoC designs.
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ASIC Turnkey Solutions
You need a trusted partner in developing A-Z of a competitive ASIC?Leverage our partnerships with leading service providers and learn about our complete development and supply chain support.
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Component Test and Analysis Laboratories
The Component Test and Analysis team specializes in electronic and mechanical components such as hybrids, connectors, cables, harnesses, passive or discrete components, and digital or linear devices. The test lab has extensive experience in developing test software to electrically and environmentally characterize virtually any integrated circuit, including analog, digital, mixed signal, converters, FPGA and ASICs, as well as experience in developing actual radiation environments for parts testing. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanation for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Component Test and Analysis team offers a 25-year history of test and analysis data — a valuable resource for addressing new customer requirements.
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ARM Development Studio 5
DS-5
ARM DS-5 is the tool-chain of choice for software developers who want to fully realize the benefits of the ARM Architecture. Comprising features such as the best-in-class ARM Compiler, powerful OS-aware debugger, system-wide performance analyzer, and real-time system simulator, DS-5 is an integrated development environment that assists engineers in delivering optimized and robust software for ARM processor-based ASICs and ASSPs.
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PCI Express 6 Base Specification Receiver Test Automation
N5991PB6A
The N5991PB6A is the receiver test automation software for bit error ratio testers, allowing you to test and characterize PCI Express 6.0 ASICs
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PCI Express 5 Base Specification Receiver Test Automation
N5991PB5A
The N5991PB5A is the receiver test automation software for bit error ratio testers, allowing you to test and characterize PCI Express 5.0 ASICs
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Compact Photoelectric Sensor
CX-400 Ver.2
Panasonic Industrial Devices Sales Company of America
For the CX-400 Series, the user has a large selection of ultra compact Photoelectric Sensors at his disposal. The Series includes three thru-beam, five retro-reflective, four diffuse reflective and four trigonometric types with foreground/background suppression. With its new ASIC (application specific integrated circuit), the Sensors require up to 60% less energy than before.
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Custom & ASSP
Offering innovative SoC, SiP, ASIC, audio/video ASSP and other custom solutions and foundry services across a wide variety of applications in the automotive, industrial, medical, and aerospace & defense markets.
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Electrical Testing Services
Integra provides extensive experience with complex test development: Digital & Mixed Signal Devices: Microprocessor, Microcontrollers DSP, ASIC. Linear: DAC, ADC, Operational Amplifier, Comparator, Multiplexer, Interface, Discrete. Memory: SDRAM, DDR, SRAM, SSRAM, Flash, EEPROM, EPROM. Logic: 74xxx, 16/32-bit, ECL. RF, 8GHz typical and experience to 50GHz: PA, LNA, Filter, Mixer. Expertise in developing test plans (semi mfgr production & device characterization)
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PCI Express 4 Base Specification Receiver Test Automation
N5991PB4A
The N5991PB4A is the receiver test automation software for bit error ratio testers, allowing you to test and characterize PCI Express 4.0 ASICs.
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Functional Testing
Functional Ethernet testing is done during the research and development phase of a product or service. It can cover many parameters depending on the DUT and the application. Using Xena’s products, your range of functional Ethernet testing includes:*Multicast*40/100G PCS and PMA Layer*Transparent Transport*Energy Efficient Ethernet (EEE)*Microbursts and random IFG*Synchronous Ethernet*Automotive Ethernet*1588v2 Performance Testing*Regression testing*Kernel drivers and NIC testing*Hardware emulation (ASIC*)
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nductive Proximity Sensors
Millions of inductive proximity sensors are currently in use in virtually all industries. They detect metal objects without contact, and are characterized by a long service life and extreme ruggedness. With the latest ASIC technology, SICK's sensors offer the ultimate in precision and reliability. SICK can provide the right solution to meet your requirements every time – from cylindrical or rectangular standard sensors with single, double or triple operating distance, to special sensors for explosive zones and harsh environments. Our sensors are the intelligent, reliable route to implementing industry-specific and customized solutions to any task involving automation.
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Microelectronic Services
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
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Mixed Signal Tester
STI9000
The STI9000 is a mixed signal ATE used for testing ASIC and MEMS products. Each STI9000 test instrument fits into a small tester mainframe and contains multi-functional analog and digital test resources.
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360 EC-FPGA
Functional correctness of FPGA synthesis from RTL code to final netlist. Systematic design errors, introduced by automated design refinement tools, such as synthesis, can be hard to detect, and damaging if they make it into the final device. Formal equivalence checking has been used for ASIC design flows for many years. As FPGAs become bigger and critical system components, exhaustively verifying the functional equivalence of Register Transfer Level (RTL) code to synthesized netlists and the final placed & routed FPGA designs is mandatory.
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Ultrascale FPGA PCIe Board
SE100 – Solar Express
Sundance Multiprocessor Technology Ltd.
SE100 is based on Xilinx’s Virtex Ultrascale FPGA XCVU190-2FLGC2104E, and is a powerful processing card with plenty of IO capabilities to meet the needs of modern compute-intensive applications such as Supercomputing, Data Centers and defense. The board can optionally be populated with 095, 125, and 160 devices in C2104 package for reduced cost. Host interface is via 8 lanes of PCIe Gen3 but the card can also be used as an embedded, standalone, hardware too. Multiple cards can be cascaded to provide a multi-FPGA system with cards connected together via the board’s fast IO channels to meet the needs of even more demanding applications like ASIC design and Stock Market fast trading systems.
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Audio MEMS Sensors
An audio MEMS sensor is an electro-acoustic transducer housing a sensor (MEMS) and an application-specific integrated circuit (ASIC) in a single package.
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ASIC / COT / FPGA Design
EL & Associates, Inc. specializes in integrated solutions for design (RTL to GDSII), Design-For-Test (DFT) and Design-For-Manufacturing (DFM) services for ASIC, ASSP, COT, and FPGA. We engage with customers from RTL phase to silicon prototype. The ELA methodology is optimized to manage risk in design, manufacture and product deployment. ELA has successfully completed over 750 designs to date.
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Power Bead Inductors
Power bead inductors are typically used in high current multi-phase voltage regulators that power processors, memory modules and high current ASICs and FPGA in a wide range of applications including servers, graphics cards, storage and data centers. The construction consists of a ferrite core assembled over a 1T or 2T winding and which allows for extremely low DCR, high peak current and low AC losses. Pulse has single phase, integrated phases and coupled inductor versions. Our high volume manufacturing enables us to produce components that are cost-effective while maintain exceptional quality and reliability.
