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- TEAM SOLUTIONS, INC.
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16 SE Or 8 Diff. Input Channels, 8 Analog Output Channels, PCI Express
APCIE-3121-16-8
Input range:?± 10 V, 0-10 V software programmable0-5 V, ± 5 V, 0-2 V, ± 2 V, 0-1 V, ± 1 V (gain)0-20 mA (option) ? software-programmable amplifier:PGA x1, x2, x5, x10 ? Conversion triggered through software,scan, timer, external event ? Onboard FIFO buffering for 256 analog values ? Data exchange through 16-bit I/Oor 32-bit memory (PCI DMA) ? Sequence RAM ? Overvoltage protection ? input filter: 160 kHz
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COM Express Type 6 Application Board With MXM Slot
CEB94022
*MXM type A supported*SATA-600*LVDS, VGA, HDMI, and DisplayPort*4 USB 2.0 and 2 USB 3.0*2 PCI Express Mini Card slots*3 RS-232/422/485 and 1 RS-232
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Mini-ITX SBC With Intel® Celeron® Processor J3355, VGA, HDMI, USB 3.0, PCI Express Mini Card Slot, MSATA And HD Audio
MANO315
*Intel® Celeron® processor J3355 (Apollo Lake)*DDR3L SO-DIMM for up to 8GB of memory*1 PCI Express Mini Card slot and PCIe x1*2 USB 3.0 and 4 USB 2.0*1 SATA-600 and 1 mSATA*4 COM supported*STD ATX Power*VGA and HDMI supported
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COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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COM Express Type 10 Starter Kit Plus
COM Express Type 10 Starter Kit Plus
The COM Express Type 10 nanoX Starter Kit Plus consists of a COM Express Type 10 core module reference carrier board that provides two PCIe Mini Card slots, 2 RJ-45 LAN ports, 2x USB 3.0, 2x USB 2.0, 1x USB client, 2x DB-9 COM, 1x SD card socket, and Mic/Linein/ Line-out. ADLINK also provides additional development tools including a verified 10.1" LVDS panel (optional), power supply, thermal solution and cabling accessories.
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COM Express Boards
COM Express is a highly integrated Computer On Module. It can be considered as a component (integrated circuit) in more complex designs.
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Single Board Computers
SBC
Our extensive line of compact, rugged SBCs is based on CPUs targeting embedded applications, ranging from the economical AMD LX800 and Vortex86DX to the high performance Intel Core i7 latest generation U series Skylake/Kaby Lake. These products adhere to industry-standard form factors such as PC/104, COM Express, ETX, EPIC, and EBX.
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COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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COM Express Type 7
The COM Express Type 7 modules deliver powerful server-class performance in a small form factor. Its high-speed interfaces and extreme performance increases the flexibility for building up Industrial IoT applications which are in need of multi-tasking, multi-threading or video rendering. Axiomtek’s COM Express Type 7 modules are well-suited for integration into compute-intensive and space-constrained applications in need of high data and network throughput, such as edge computing, micro server, data transmission device, and other networking fields.
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COM Express Type 6
The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies.
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COM Express Type 2
Axiomtek COM Express Type 2 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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Computer-On-Module
CM22301
LinkedHope Intelligent Technologies Co.,Ltd.
CM22301 uses Intel® sixth-generation Skylake platform and Core M low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.1GHz and the display output resolution can be up to 4K. CM22301 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. CM22301 supports up to 16GB dual-channel low-voltage DDR3L memory populated onboard, and up to 64GB on-board solid state disk silicon, as benefit the development of ruggedized products for harsh environment applications.As defined by VITA 59 specification, CM22301 provides up to 6 PCIe lanes, enabling flexible functionality expansions, such as NICs, DAQs, video capture and so on. Meanwhile, CM22301 also provides up to date computer interfaces like GbE, SATA3, USB3.0/2.0, HD Audio, etc. CM22301 uses the same 220pin board-to-board connector and Type10 pin out definition as COM Express.
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC
eBOX640-500-FL
The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.
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COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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COM Express
COM Express defines standardized footprints and pin-outs for Computer-on-Modules. With the Revision 2.0, PICMG added the compact footprint (95x95mm) to the basic footprint (125x95mm) and extended the pin-outs being future-proof. New Digital Display Interfaces (DDI) and super-fast USB 3.0 are available. The new Pin-out Type 10 in COM Express Revision 2.0 supports perfectly modules in the COM Express mini footprint (84x55 mm).
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COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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COM Express® Type 6 R3.1 Reference Carrier Board In ATX Form Factor
Express-BASE6 R3.1
Express-BASE6 R3.1 is an ATX COM-Express Type 6 Basic / Compact size module reference carrier board based on PICMG COM-Express Revision 3.1. Together with the COM-Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Qseven
Qseven module is a very small size Computer-on-Module targeting towards low power and mobile applications. The Qseven footprint is smaller than that of COM Express and ETX. The maximum power consumption is no more than 12 watt.
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COM Express Type 6 Basic Module With Intel® Xeon® And 6th Gen Intel® Core™ I7/i5/i3 Processor, Intel® CM236/QM170/HM170
CEM500
The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
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Qseven® Reference Carrier Board
Q7-BASE
Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for -PCI Express graphics cards in notebooks.
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, LAN, DIO 2-in/2-out (Sink Type) And 2 PCIe Mini Card Slots
IRU131-SI
*RISC-based (i.MX 6UltraLite) processor 528 MHz*512MB DDR3 SDRAM onboard*8GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi, 3G/4G or LoRa)*1 isolated COM port*1 isolated DIO 2-in/2-out (Sink Type)*Power input range of 9V to 48V DC with terminal block*Embedded Linux operating system (Yocto)*Wide operating temperature range from -40°C to +70°C*Supports OPC UA
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COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
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COM Express Type 7 Basic Module With Intel® Xeon® D-1500 & Pentium® Processor D1500
CEM700
The CEM700 offers scalable processor options from the 16-core Intel® Xeon® D-1577 processor to the 4-core Intel® Pentium® D1519 processor (codename: Broadwell DE). This COM Express Type 7 module comes with two 10GBASE-KR channels and supports two DDR4-2400 SO-DIMM slots for up to 32GB system memory. It delivers powerful server-class performance in a small form factor of 125 x 95 mm. Axiomtek's CEM700 is well-suited for integration into compute-intensive and space-constrained applications in need of high data and network throughputs, such as edge computing, microserver, data transmission device, and other networking fields. The Axiomtek's CEM700 incorporates two 10GBASE-KR interfaces and an NC-SI (Network Controller Sideband Interface) for remote management to fulfill server application demands. The Intel® Broadwell DE-based module has a wide operating temperature range from -20ºC to +70ºC (or optionally -40ºC to +85ºC) to fully serve the needs of diverse applications. To enable fast turnkey evaluation, Axiomtek also provides CEB94701, the COM Express type 7 baseboard to operate with CEM700. Customers can quickly emulate the functionality for software development and hardware verification.
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COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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COM-Based SBC with WL8665UE CPU / COM Express Carrier
GEMINI
GEMINI is a COM Express Compact type 6 carrier board and SBC with PCI/104-Express I/O expansion. Feature-rich GEMINI offers the highest performance in a compact 4.0 x 4.0' / 102 x 102mm size, with its combination of COM Express CPU module and full support for PCIe/104 type 1 connectivity (PCI-104 up to 4 modules, PCIe-104 x1 up to 4 modules, and PCIe/104 x16). Gemini is designed to support a variety of COM Express modules including Bay Trail, Apollo Lake to Core i7 8th generation and Xeon.
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Open Pluggable Specification (OPS) Digital Signage Player With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H81 And TPM 1.2
OPS883-H
The OPS883-H OPS-compliant digital signage player is powered by the 4th generation Intel® Core™ i7/i5/i3 processor (codename: Haswell) with the Intel® H81 chipset. It has one 204-pin DDR3 SO-DIMM socket with maximum up to 8 GB. It offers stunning 4K Ultra High Definition (UHD) content via a HDMI port. The Intel® Core-based OPS883-H is ideal for multi-display applications in airport information board, shopping mall, corporate, education, hospitality, religious organization, bank, retail store, restaurant, performing art center and many more. This smart pluggable signage module is connected to OPS-compliant display via a standardized JAE TX-25 plug connector, and includes DisplayPort, UART, audio, USB 3.0 and USB 2.0 signals. To fill different application needs, the signage unit reserves a wide choice of I/O ports on front panel, including one USB 3.0 ports, two USB 2.0 ports, one COM port, audio (in/out) and a Gigabit Ethernet port. This slim-type OPS system has one internal PCI Express Mini Card slot to connect Wi-Fi or 3G/ LTE modules to satisfied users wireless needs. It features one easy-to-access 2.5” SATA HDD as storage device. Also, it supports TPM 1.2 feature which is designed to secure system.
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COM Express Type 10 Mini Application Board With LVDS, VGA, Dual LAN And Audio
CEB94018
*84 x 55 mini size form factor*2 GbE LAN*SATA and mSATA*LVDS and VGA*6 USB 2.0*2 PCI Express Mini Card slots
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COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
Express-ID7
ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.
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COM Express Type 7 10GbE SFP+ Network Adapter Card
CEI-2x10G SFP+
- Support up to two 10GbE SFP+ interfaces- Inphi CS4227 inside- COM.0 R3.1 Type 7 compliant- Dedicated for Express-VR7
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COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
