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- Pickering Interfaces Inc.
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PXI/PXIe MEMS Optical MUX, Dual 2-Channel, Single-Mode, 9/125 Fiber
40-855A-122-HI
The 40/42-855A-122-HI is a PXI/PXIe dual 2-channel multiplexer with FC/PC, includes hardware interlock connectors and is part of Pickering's range of PXI Fiber Optic MEMS Switching modules. They are available in many high density formats with a choice of different connector styles to suit most applications: FC/APC (for optimal performance), FC/PC and SC/PC for general applications and LC and MU for high density applications.
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Automated X-ray Inspection (AXI)
Automated X-ray inspection (AXI) is a testing approach based on the same principles as automated optical inspection (AOI). Instead of cameras, X-rays are used to automatically inspect features.
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Grain Inspector
iS-G1
The iS-G1 is a full line speed optical module for the inspection of crystal grains.Using our new grain imaging technology, the iS-G1 is able to inspect as cut wafers at full inline speed with no need to stop the conveyor belt. Automated algorithms analyze the grains and report metrics.
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Signal Integrity Test Products
RoBAT RCI
*TDR & TDT, Measurement Capabilities*Impedance, Skew, Backdrill measurements*Automated Optical Inspection*DC Electrical Test*Now available with 4 heads*24 port (1 port per channel) TDR/TDT unit*Future capabilities – Fully automated VNA test (4 port S-Parameter Measurement)
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Automated Optical Inspection (AOI)
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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Automated Optical Inspection (AOI)
TR7700 SIII
TR7700 SIII is the newest generation of TRI's AOI solutions, delivering precise multi-phase inspection at full speed. By combining an ultra-fast camera, intelligent auto conveyor, and new GUI, the TR7700 SIII offers a powerful and easy to use AOI solution with fast programming, optimized board loading, production line integration and support for offline programming. TRI's new color algorithm combined with multiple lighting phases increase defect coverage and help deliver highly accurate inspection results with a minimum of false calls.
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3D Microscope
BVM-5006
BVM-5006 Electric 3D Microscope features the quality optical system, high resolution, large field of view, high zoom ratio, novel design and one-up technology, easy and automatic operations. Includes: Motorized zooming, motorized observation angle for changing and optional motorized focusing. The speed can be adjusted while changing observation angle. With the angle attachment, the microscope can realize 3D image effects for observing the components and deep holes. The LED lights can generate high brightness. Theoretically the service life of LED lights can reach 20,000 hours. The LED lights with area control function can illuminate from different angles for convenient multi-angle inspections. The M-N3D Microscope can be widely used in micro-electronics, automated monitoring and testing industries. By selecting the appropriate objectives and video couplers, different magnification, field of view and depth of field can be acquired. Digital and Analog video systems can meet the different users' demands.
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Automated Surface Inspection for Glossy Components
Flawlessly glossy surfaces are among the most important quality features of many premium products. The smallest surface defects immediately have a degrading effect on the product. The result: disappointed end customers or buyers. At the same time, reflective surfaces are often very sensitive and a challenge for optical metrology. A manual inspection is tedious, expensive, and ultimately always governed by subjective decision criteria. During production, faulty painting or coating processes can cause high scrap rates. Defects that are not detected even during the final inspection can lead to expensive complaints and, in the worst case, to the loss of the customer. Only an efficient, automated surface inspection achieves the highest quality at acceptable costs.
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Compact IPC
Designed to function as the intelligent edge for manufacturing equipment, IPC-seires is an ultra-compact modular system equipped with 2/4 PCIe/PCI slots for integrating diverse add-on cards, such as I/O cards, motion cards, vision cards, and GPU cards to support machine control and vision applications, or provide artificial intelligence for automated optical inspection (AOI) operations.
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3D Automated Optical Inspection Systems
New 3Di Series
To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
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Automated Optical Inspection
AOI
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Circuit Card Assembly
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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2-port/4-port PCI Express GigE Frame Grabber Card
AX92320
The AX92320 supports PCI Express x4 lane, two or four independent Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports and GigE Vision camera compliance. The PCI Express x4 frame grabber can provide up to 30 watts at 54 VDC power to port which allows power to be supplied to connected PoE-based devices, such as GigE Vision cameras in machine vision systems. The intelligent GigE Vision card also supports IEEE 1588 (precise time protocol), enabling synchronization with multi-camera acquisition. Combining IEEE 1588 and PoE function, the card utilizes a single Ethernet cable for power, data, and synchronization. Furthermore, it supports jumbo frames up to 9.5KB. The AX92320 is ideal for PoE applications such as automated optical inspection (AOI), factory automation, and PC-based surveillance systems.
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High-Accuracy Automated Optical Inspection Systems
Fully-automated and high-accuracy 3D inspection and measurement systems. High-power, long working distance optics and high-resolution digital camera are perfect for high-magnification applications. These are full-color systems capable of high-accuracy measurements, automated defect detection and color verification.
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Signal Integrity Test Products
S1
*Fixtureless Test Solution*Automated Optical Inspection*DC Electrical test*Tests any backplane – Small, large, simple, complex*Now available with 4 heads
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Automated Gage Measurement System
AGMS
Our Automated Gage Measurement System for Sand Screen (AGMS) provides accurate and repeatable optical measurements for all wire-wrapped gaps along the full screenlength. This inspection machine enables oil field sand screen manufacturers to meet the measurement requirements of API Spec 19S1 and ISO 17824:2009.
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ROBOT-MOUNTED OPTICAL CMM 3D SCANNERS
METRASCAN-R
Part of the MetraSCAN 3D line-up, the robot-mounted MetraSCAN-R optical CMM 3D scanning systems are fast and accurate scanning solutions designed for 3D automated inspection of parts on the production line and on the shop floor. In combination with industrial robots, the MetraSCAN-R series increases the reliability, speed and versatility of on-line inspection and quality control (QC) process.
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3D Automated Optical Inspection
Zenith UHS
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Automated Optical Inspection Solutions
Adjustable criteria for different process application or modelFlexible algorithms programming editor for mono-crystalline and multi-crystalline silicon solar cellsMultiple interface to communicate with manufacturing equipment or information systemVarious defects inspection capability from multilayer LED lighting designFlexible design that can be easily integrated to your in-line printing system and sorting system
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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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CMOS Dual USB3 Cameras
CELERA
CELERA CMOS Dual USB3 cameras provides unrivaled speed, extreme flexibility and quick system integration. Its double USB3 interface, ultra-fast acquisition rate, extremely reduced dimensions and rugged design make CELERA cameras suitable far the most demanding applications: automated optical inspection, high performance sorting systems, industrial metrology, microscopy, medical diagnostics and machine vision. CELERA cameras are powered directly by the USB3 bus eliminating the need for external power adapters. USB3 provides the most cost effective and widespread interface, pushing speed performances at the top.
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Inspection System
Pixie
3-D Metrology for automation. Pixie is a standard system for automated optical quality inspection. Pixie can be configured with 2 to 5 servo driven axis movement and the high-speed measurement capabilities make it suitable for inline and stand-alone solutions.
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Atomic Force Microscope
HDM Series
The task of identifying nanoscale defects is a very time consuming process for engineers working with media and flat substrates. Park NX-HDM is an atomic force microscopy system that speeds up the defect review process by an order of magnitude through automated defect identification, scanning and analysis. Park NX-HDM links directly with a wide range of optical inspection tools, thus significantly increasing the automatic defect review throughput. In addition, Park NX-HDM provides accurate sub-angstrom surface roughness measurements, scan after scan. Park NX-HDM, together with its industry's lowest noise floor, and its unique True Non-Contact™ technology, it is the most accurate AFM for surface roughness measurement in the market.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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CMOS USB3 Cameras
CELERA One Series
CELERA One camera series provide the same excellence in quality, flexibility and performances of CELERA cameras, with the only exception of a single USB3 interface, while keeping the original extremely reduced dimensions and rugged design that make CELERA One cameras suitable for most applications: automated optical inspection, high performance sorting systems, industrial metrology, microscopy, medical diagnostics and machine vision.
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THT AOI
Mek THT AOI overcomes these challenges of automated through-hole inspection with a unique combination of mechanical, optical and software design alternatives, unavailable in many conventional systems.
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PV Cell Inspection
Solar developed a complete solution for stand-alone optical quality sorting, complete with inspection, classification and handling. The system allows implementation of automated optical inspection without changing existing machines.
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Automated Optical Inspection System
AOI Series
Perform visual inspections of printed circuit boards (PCB) during manufacturing in which a camera is used to scan the board in extremely fine detail to check for any defects or failures.
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2D Automated Optical Inspection Systems (2D-AOI)
BF1 Series
Saki’s unique line scanning technology and coaxial overhead lighting enables high-speed accurate inspection.
