Teledyne DALSA
DALSA Corporation is an international high performance semiconductor and electronics company that designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing specialized wafer foundry services.
- 519 886 6000
- 519 886 8023
- sales.americas@dalsa.com
- 605 McMurray Road
Suite 142
Waterloo, Ontario N2V 2E9
Canada
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CL PX4 Dual Frame Grabber
Xcelera-CL PX4 Dual
Building on the field proven technology and performance of Teledyne DALSA’s X64 frame grabbers the new Xcelera Series leverages the PCI Express (PCIe) platform to bring traditional image acquisition and processing technology to new levels of performance and flexibility. The PCIe host interface is a point to point host interface allowing simultaneous image acquisition and transfer without loading the system bus and involving little intervention from the host CPU. The X64 Xcelera-CL PX4 Dual is a highly versatile PCIe frame grabber capable of acquiring images from two independent Camera Link™ Base cameras and performing image transfers at rates up to 1024MB/s. Its low cost, combined with its ability to support multiple tap configurations from area and linescan monochrome/RGB cameras simultaneously; in addition to its onboard FPGA Bayer decoding and real-time shading correction makes the X64 Xcelera-CL PX4 Dual an ideal solution to a wide variety cost-sensitive applications.
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Area Scan Camera
Genie Nano-CXP
Introducing Genie Nano-CXP, a camera designed for full-throttle performance. Genie Nano-CXP builds on Nano's proven, industry leading reputation and leverages a CoaXPress 6Gbps interface to deliver the maximum throughput from leading edge high resolution CMOS image sensors.
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Medical And Dental X-Ray
Teledyne DALSA offers powerful, innovative CMOS X-Ray detectors combining industry-leading performance with cutting-edge features for applications such as orthopedic and surgical radiology, mammography, intra- and extra-oral dental radiology, CT, and bone densitometry
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Xcelera Frame Grabber
Xtium-CLHS PX4
Building on the field proven capability of Teledyne DALSA’s Xcelera frame grabber series, the Xtium™-CLHS PX4 is based on AIA’s CameraLink HS standard and uses PCI Express™ Gen 2.0 expansion bus to deliver high speed image acquisition and image transfer to the host memory. Xtium-CLHS uses industry standard CX4 cable to delivery up to 2.1 GB/s of image acquisition over a single cable to go beyond 15m and host transfer speeds of up to 1.7GB/sec - all in a compact, half-length, single slot solution.
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CoalXPress Frame Grabber
Xtium-CXP PX8
The Xtium™-CXP is based on the industry standard PCI Express™ Gen 2.0 expansion bus to deliver high speed access to host memory. The Xtium series offers high performance frame grabbers for CameraLink, CameraLink HS and CoaXPress interface standards. The Xtium Series takes full advantage of PCIe Gen 2.0 platform to deliver bandwidth up to 3.4 GB/s using PCIe x8 slots. By enabling maximum sustained throughput and ready-to-use image data, the Xtium series minimizes CPU usage and improves processing times for the host applications. In addition, the Xtium series offers enhanced memory architecture to handle area and line scan, monochrome and color cameras. In addition, the Xtium-CXP series support image acquisition rate of up to 6.25 Gb/s from four input channels.
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Multi-Interface Frame Grabber
Xtium2 CLHS PX8
Building on the field proven Teledyne DALSA’s Xtium family of frame grabbers, the Xtium™ 2 CLHS PX8 features CameraLink HS standard on the PCI Express™ Gen 3.0 platform. The Xtium2-CLHS supports Active Optical Cable (AOC) and industry standard CX4 cables. This single cable, single slot solution supports up to 7-CLHS lanes, each operating at 10.3 Gbits/s, to acquire images at up to 8.4 GBytes/s and transfer them using PCIe x8 slots to the host memory.
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PCI Express Image Acquisition Frame Grabber
Xcelera-HS PX8
The Xcelera-HS PX8 has been built within Teledyne DALSA’s Trigger-to-Image Reliability technology framework. Trigger-to-Image Reliability leverages Teledyne DALSA’s hardware and software innovations to control, monitor and correct the image acquisition process from the time that an external trigger event occurs to the moment the data is sent to the host, providing traceability when errors do occur and permitting recovery from those errors.
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Multi-Interface Frame Grabber
Xtium 2 CLHS PX8 LC
The Xtium™ 2 CLHS PX8 features CameraLink HS standard on the PCI Express™ Gen 3.0 platform. This single cable, single slot solution supports up to 4-CLHS lanes, each operating at 10.3 Gbits/s, to acquire images at up to 5.0 GBytes/s and transfer them using PCIe x8 slots to the host memory. The Xtium2-CLHS supports Active Optical Cable (AOC) to extend the cable length beyond 100 meters. Built-in data-forwarding and multi-board sync capabilities deliver a platform for distributed processing for high-speed, computational intensive machine vision applications.
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Microbolometer Sensors
Calibir GX Family
The Calibir GX camera family features our latest microbolometer sensor, designed, fabricated, and packaged in our own foundry. With great sensitivity in longwave infrared range (8-12 µm), it features both shutter and shutterless operation and rapid image output on power up while delivering uniform response over the entire operating temperature range, making it an ideal component for thermal imaging systems requiring uninterrupted image acquisition. The GX series also offers our own advanced 21-bit ADC design for unparalleled intra-scene dynamic range without the need for a gain reduction, allowing for the best possible NETD over a vast range of temperature (>600C).
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CCD Foundry Services
Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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Detachable X-Ray Detector
RadEye HR
The Remote RadEye HR x-ray detector is a slim, lightweight, rugged solution for high-resolution radiation imaging. The detector is suitable for industrial inspection applications where images are taken in tight or difficult-to-reach spaces.
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Xineos Scanning
Teledyne DALSA's leadership in CMOS innovation lets our Xineos scanning products deliver three times more sensitivity and five times more signal-to-noise performance than other standard technologies at equal X-ray dose conditions. CMOS image detectors offer numerous advantages including the ability to record smaller image details with higher resolutions – allowing for the diagnostics of medical anomalies at earlier stages, and significantly increasing the probability of early intervention, patient recovery, and reduced treatment costs.
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Frame Grabbers
Teledyne DALSA delivers the industry's most reliable and versatile family of frame grabbers combining industry leading performance with industry leading feature sets, great value and extensive camera support. Board-level innovations deliver Trigger-to-Image Reliability significantly increasing system performance and ultimately helping to increase yield, while CamExpert, the camera configuration utility included with our free Sapera LT SDK, leverages the power of our acquisition boards in one of the industry's most efficient and easy to use interfaces.
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Vision Systems
Our GEVA vision systems offer the performance and flexibility to inspect multiple parts, assemblies or surfaces at the same time. These systems are equipped with multi-core processors, high-speed camera ports and versatile I/O options to match your application and factory integration requirements.