Scientific Computing International
SCI is a leading innovator and provider of advanced metrology systems and analysis software to major companies in the semiconductor, optoelectronics, data storage, display, MEMS, and optical coating industries.
- (760) 634-3822
- info@sci-soft.com
- 6355 Corte Del Abeto
Suite C-105
Carlsbad,, CA 92011
United States
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Benchtop Metrology System
FilmTek 2000 SE
Scientific Computing International
Benchtop metrology system delivering unmatched measurement performance, versatility, and speed for unpatterned thin to thick film applications. Ideally suited for academic and R&D settings. Combines spectroscopic rotating compensator ellipsometry, multi-angle polarized spectroscopic reflection, and intuitive material modeling software to make even the most demanding of measurement tasks simple and reliable.
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Data Storage
Scientific Computing International
Refers to magnetic, optical or mechanical media that records and preserves digital information for ongoing or future operations.
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Semiconductor
Scientific Computing International
Materials which have a conductivity between conductors (generally metals) and nonconductors or insulators
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Multiple Angle Reflectometry
FilmTek 4000
Scientific Computing International
Fully-automated wafer metrology optimized for photonic integrated circuit manufacturing. Delivers unmatched measurement accuracy, with a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems. Designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.
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Benchtop Metrology Solution
FilmTek 2000 PAR-SE
Scientific Computing International
Our most advanced benchtop metrology solution, engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to deliver the highest accuracy, precision, and versatility in the industry. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Advanced Packaging & TSV
Scientific Computing International
System providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements.
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Reflection/Transmission Spectrophotometry
FilmTek 3000 PAR-SE
Scientific Computing International
Engineered to meet the needs of any advanced thin film measurement application, excelling at material characterization on both transparent and non-transparent substrates. Combines spectroscopic ellipsometry, DUV multi-angle polarized reflectometry, and transmission measurement with a wide spectral range to meet the most challenging of measurement demands in both R&D and production. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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Optical Thin-Film Metrology for Advanced Thin Films
FilmTek 6000 PAR-SE
Scientific Computing International
Production-proven metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. Accommodates 200 or 300 mm wafer metrology. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques.
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LED
Scientific Computing International
A light-emitting diode (LED) is a semiconductor device that emits light when current flows through it.
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DUV-NIR Spectroscopic Reflectometry
FilmTek 2000
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter. Capable of simultaneous determination of multiple film characteristics within a fraction of a second per site.
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Photonics & Telecom
Scientific Computing International
photonic integrated circuit manufacturing delivers unmatched measurement accuracy.
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Solar Photovoltaic
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film.
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R&D
Scientific Computing International
A term to describe the effort a company devotes to the innovation, and improvement of its products and processes.
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Micro-spot DUV Spectroscopic Reflectometry
FilmTek 2000 PAR
Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.